Method of manufacturing support structures for lighting devices and corresponding device

ABSTRACT

A method of manufacturing support elements for lighting devices includes: providing an elongated, electrically non-conductive substrate with opposed surfaces, with an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along the non-conductive substrate with at least one portion of the non-conductive substrate left free by the set of electrically-conductive tracks, forming a network of electrically-conductive lines coupleable with at least one light radiation source at said portion of said non-conductive substrate left free by the electrically-conductive tracks. Said forming operation includes selectively removing e.g. via laser etching a further electrically-conductive layer provided on said non-conductive substrate, or printing electrically-conductive material onto the non-conductive substrate. The electrically-conductive tracks and the network of electrically-conductive lines may be coupled with each other e.g. by means of electrically-conductive vias extending through the non-conductive substrate.

CROSS-REFERENCE TO RELATED APPLICATION

This application claims priority to Italian Patent Application SerialNo. 102016000088158, which was filed Aug. 30, 2016, and is incorporatedherein by reference in its entirety.

TECHNICAL FIELD

The description relates to lighting devices.

One or more embodiments may refer to lighting devices employingelectrically-powered light radiation sources, e.g. solid-state lightradiation sources, such as LED sources.

BACKGROUND

The field of lighting technology, e.g. in Solid State Lighting (SSL),increasingly demands lighting modules, e.g. LED modules, with shortdevelopment and lead times.

The linear and flexible (“flex”) LED modules which are employed nowadaysmay include a plurality of electrical units which are connected e.g. inparallel (and which include one or more LED strings or chains and therelated driving circuitry) with a consequent increase of the supplycurrents delivered along the module.

This fact may affect the voltage drop on the supply line or “track” VDDand on the ground line GND, and therefore also the operation of theelectrical units distributed along the LED module.

Another aspect which may acquire significance is linked to the possibleuse of Flexible Printed Circuit Boards (FPCBs) which may be implementedas rolls, so as to achieve quite long LED modules (e.g. having a lengthof a few metres), the possibility being given to omit jumpers orconnectors for the connection of the various electrical units.

FPCB boards may include laminates of metal materials such as copper oraluminium (either single- or double-sided) which may require, in orderto achieve a given circuit arrangement, various chemical processes aswell as, in some cases, a specific machining, leading to rather longmanufacturing times.

This aspect may be particularly critical in the case of reel-to-reel(R2R) processes, as opposed to methods based on laminar boards orelements (sheet-to-sheet).

In this regard, LED modules (e.g. modules of an elongated, optionallyribbon-like and flexible shape) may comprise a plurality of SingleElectrical Units (SEUs) connected in parallel and arranged along aribbon-shaped structure.

As previously stated, the electrical connection among the various SEUsdistributed along the module may be achieved via two or moreelectrically-conductive lines or “tracks”, e.g. having the functions ofsupply (VDD) and ground (GND), with the possible presence of furtherlines, having control and/or feedback functions, from the lightradiation sources, e.g. in the case of multi-channel modules as RGB,RGBW or TW (True White).

A solution which may be resorted to in order to implement rather longLED modules may consist in using laminates which may be clad, e.g. onlyon one side, with a metal material such as copper or aluminium, so thatsaid lines or tracks are rather wide and/or thick, thereby obtaining ahigh conductive section and therefore a low electrical resistance.

This solution, however, suffers from a drawback: in order to change thecircuit layout, it may be necessary to completely redesign the FPCBsupport, possibly entailing the intervention of the componentmanufacturer, with a consequent increase in costs and lead time.

Moreover, the thickness of said conductive layer (e.g. of copper oraluminium) is usually standardized and limited to certain values, suchas e.g. 35 μm, 75 μm and 105 μm (1 μm=10⁻⁶ m), the presence of ratherlarge thicknesses being prone to reduce the resolution of the lines ortracks, which may lead to a limitation regarding the possible use ofsmall-sized (e.g. LED) components.

A thick conductive layer may also affect a key feature of the module,i.e. flexibility. In a complementary way, rather wide lines or tracksmay lead to an increase of the width of the product as a whole, whichmay represent a disadvantage in various applications.

Another possible solution in order to implement rather long flexible LEDmodules consists in using laminates which are clad with a metal material(e.g. aluminium or copper) on both sides; said lines or tracks areimplemented on the bottom conductive layer, which is subsequentlyconnected to the top layer by means of so-called electrically-conductivevias. The interconnecting lines between said vias and the circuit withthe components may be arranged on the top conductive layer.

In this case as well, a change of the circuit layout may imposeredesigning the whole FPCB component completely, which again may requirethe intervention of the component manufacturer; this may lead toadditional activities and/or to the need of using further tools, with asubsequent increase of costs and lead time.

SUMMARY

One or more embodiments aim at overcoming the previously outlineddrawbacks.

According to one or more embodiments, said object may be achieved thanksto a method having the features set forth in the claims that follow.

One or more embodiments may also concern corresponding devices.

The claims are an integral part of the technical teaching providedherein with reference to one or more embodiments.

One or more embodiments may envisage different solutions, thepossibility being given of implementing FPCB components having a highcustomization degree, by resorting either to single-sided or todouble-sided clad substrates.

In one or more embodiments it is possible to employ hybrid techniques,which may be defined in the final product with possible reductions ofmanufacturing times.

One or more embodiments may employ laminates with a metal material ofaluminium or copper (with or without an adhesive layer sandwichedbetween base layer and conductive layer(s)), the conductive lines or“tracks” being adapted to be implemented via a standard etching, e.g.chemical etching, method.

One or more embodiments may envisage the use of electrically-conductivevias at given positions in the module, the possibility being given ofusing said vias in a wide variety of possible configurations.

In one or more embodiments, said electrically-conductive vias may beimplemented with standard techniques, e.g. by drilling holes andsubsequently capping them, e.g. by means of an electrodepositionprocess.

One or more embodiments may offer one or more of the followingadvantages:

-   -   rapid and low-cost management, with possible customization, of        new products such as e.g. linear and/or flexible LED modules,        without negatively affecting the features (e.g. the electrical        resistance) thereof;    -   the changes may be carried out directly by the assembler of the        final product, without the need to involve the manufacturer of        the FPCB component;    -   several different circuit layouts may be managed on one single        FPCB component, the possibility being given of increasing the        standardization level of the copper or aluminium clad laminates,        e.g. as regards the possible use of a chemical etching;    -   high flexibility of the achievable modules.

BRIEF DESCRIPTION OF THE DRAWINGS

In the drawings, like reference characters generally refer to the sameparts throughout the different views. The drawings are not necessarilyto scale, emphasis instead generally being placed upon illustrating theprinciples of the disclosed embodiments. In the following description,various embodiments described with reference to the following drawings,in which:

FIGS. 1 to 10 show possible steps of one or more embodiments,

FIGS. 11 to 19 show possible steps of one or more embodiments, and

FIGS. 20 to 29 show possible steps of one or more embodiments.

It will be appreciated that the Figures correspond to ideal crosssections of elongated (e.g. ribbon-shaped) elements, which may beconsidered as having indefinite length.

It will be appreciated, moreover, that for better clarity and simplicityof illustration the various Figures and the elements shown therein maynot be drawn all to the same scale.

DETAILED DESCRIPTION

In the following description, various specific details are given toprovide a thorough understanding of various exemplary embodiments. Theembodiments may be practiced without one or more specific details, orwith other methods, components, materials, etc. In other instances,well-known structures, materials or operations are not shown ordescribed in detail to avoid obscuring various aspects of theembodiments.

Reference throughout this specification to “one embodiment” or “anembodiment” means that a particular feature, structure, orcharacteristic described in connection with the embodiment is includedin at least one embodiment. Thus, the possible appearances of thephrases “in one embodiment” or “in an embodiment” in various placesthroughout this specification are not necessarily all referring to thesame embodiment. Furthermore, particular features, structures, orcharacteristics may be combined in any suitable manner in one or moreembodiments.

The headings provided herein are for convenience only, and therefore donot interpret the extent of protection or scope of the embodiments.

One or more embodiments may employ a laminate material including a corelayer 10 (e.g. of polyimide (PI) or any other material, such as anorganic material), adapted to be used as a base layer for a single-sidedor double-sided FPCB module, with electrically-conductive layers, e.g.metal layers of aluminium or copper.

Said electrically-conductive layers, denoted e.g. as 12 and 14 in thefigures, may have either the same thickness or different thicknesses.

For example, in the case of a double-sided solution as exemplified inFIGS. 1 to 10, there may be present a thin first (top or front) layer12, having e.g. a thickness of 18 or 35 μm (1 μm=10⁻⁶ m) and a thicksecond (lower or bottom) layer 14, having e.g. a thickness of 35, 70 or105 μm (1 μm=10⁻⁶ m).

In one or more embodiments, said electrically-conductive layer(s) 10 maybe connected to base layer 10 by means of intermediate adhesive layers120, 140, the presence whereof is not however mandatory.

One or more embodiments may envisage the implementation of theelectrical connection of electrically-conductive layers 12, 14 by meansof electrically-conductive vias. In one or more embodiments, two or morelines or “tracks” may be formed e.g. in bottom layer 14 by using astandard, e.g. chemical, etching process, while the circuit on the toplayer may be obtained e.g. via laser etching or other methods ofremoving material selectively (that is, in certain zones and not others)such as e.g. mechanical etching (cutting wheel etching), plasma etching,PCB milling.

In this respect, one or more embodiments may take into account thedifficulty of chemically etching conductive layers having differentthicknesses, due to the different etching tolerances as a function ofthe conductor thickness.

One or more embodiments may envisage, as exemplified in FIGS. 1 to 10,in a base structure as exemplified in FIG. 1, the drilling of throughholes (FIG. 2) adapted to be capped via an electrodeposition ofelectrically-conductive material, so as to originate (see FIG. 3)electrically-conductive vias 16 traversing structure 10, 12, 14(including the optional adhesive layers 120 and 140).

FIG. 4 exemplifies the possibility of subjecting bottom layer 140 (whichmay be coated, 160 a, with the previously electro-deposited material) toa chemical etching, so as to create two or more electrically-conductivelines or tracks extending along the length of the structure shown in theFigures.

One or more embodiments may envisage, for example, the formation of twotracks, respectively denoted as 141 and 142. The set of tracks,exemplified herein by tracks 141, 142 may however include any number oftracks.

In one or more embodiments, the chemical etching treatment of layer 14may be carried out so as not to affect the top or front conductive layer12, for example by forming, above electro-deposited layer 160 a, aprotective film (e.g. a dry photopolymer film).

FIG. 5 exemplifies the possibility of applying a base layer 18 on tracks141, 142, e.g. via ad adhesive connection with a material 180 which, asindicated in FIG. 5, may also penetrate the gaps between tracks 141,142.

FIG. 6 exemplifies the possibility of subjecting top layer 12 to a LEetching (e.g. by means of a laser beam, using a UV- or a CO²-basedlaser), so as to form into said layer a circuit network which is hereshown, by way of example only, as two lines 121, 122 (FIG. 7).

In one or more embodiments, this sort of etching may be carried out morerapidly than a chemical etching.

Moreover, an etching such as a laser etching enables to manage moreeasily, also as regards a possible customization, the topology of thecircuit network 121, 122.

This procedure may moreover enable to define, at the level of circuits,laminates having conductive layers of different thicknesses, which israther difficult to achieve by means of a standard chemical etching.

FIG. 8 exemplifies the possibility of applying, onto the conductivelines of the circuit network formed by way of laser etching LE (whichare represented herein, by way of example only, as two lines 121, 122),a mask or cover lay 20, which may be silk-screen printed or of the typeknown as Liquid Photo Imageable (LPI), so as to originate protected(masked) areas which may host electrical contact pads.

After this step (which however is not strictly mandatory), a surfacefinishing may be carried out consisting e.g. in a silver immersion orany one of the treatments known as OSP (Organic Surface Protection),HASL (Hot Air Solder Level), ENIG (Electroless Nickel Immersion Gold),and on the portions of the electrically-conductive lines (e.g. 121, 122)of the circuit network formed via LE etching which are left free by mask20 it is possible to form contact pads 22. On the pads 22 it is possibleto apply solder masses or an electrically-conductive adhesive 24 (seeFIG. 9) for mounting components such as e.g. electrically-powered lightradiation sources (e.g. solid-state sources such as LED sources) orother electrical components, optionally via an SMD mounting operation.

Such LEDs/components are schematically shown as L in FIG. 10.

One or more embodiments as exemplified in FIGS. 11 to 19 may envisage abase structure which once again exhibits a base layer 10 which is clad(in this case according to a single-sided solution) with a metalmaterial such as aluminium or copper 14.

For reasons which will be better detailed in the following, in theillustration of embodiments as exemplified in FIGS. 11 to 19, reference14 denotes the electrically-conductive coating located on the upper sideof base layer 10. In one or more embodiments, as exemplified in FIGS. 11to 19, two (or more) tracks previously denoted as 141 and 142 may beformed in said layer via a chemical etching process.

Moreover, on the same top layer of substrate 10, in the area where theelectrically-conductive layer 14 has been removed in order to form thetracks 141, 142, there may be formed circuits obtained e.g. via inkprinting. Both types of electrically-conductive lines (i.e. tracks 141,142 and the circuits which are printed in the area which is left free)may then be connected e.g. via passive and/or active components such asresistors, diodes, transistors such as e.g. SMD components and/orcomponents of the type currently referred to as zero ohm components: seee.g. en.wikipedia.org/wiki/Zero-ohm link.

FIG. 12 exemplifies the condition wherein the electrically-conductivelayer 14 has been chemically etched, so as to form tracks 141, 142(which may be present in any number, therefore also in a number higherthan two).

In one or more embodiments, tracks 141, 142 may be subjected to asurface finishing treatment as previously described (e.g. silverimmersion, OSP, HASL, ENIG).

FIG. 13 exemplifies the possibility of applying a protective layer (i.e.a mask layer, such as e.g. a dry photopolymer film 14 a) onto tracks141, 142. Said protective mask layer may then be removed, as exemplifiedin FIG. 14, so as to remain only to cover tracks 141, 142 and leave thearea between them free (or in general an area left free by tracks 141,142 on the surface of the base substrate 14).

In one or more embodiments, in said area there may be formed, e.g. viaconductive ink printing, a circuit network 30, which is exemplifiedherein as two electrical lines 301 and 302: this solution is of coursemerely exemplary, because the shape and the arrangement of circuit 30may be chosen at will, also thanks to the high degree of flexibilitywhich may be achieved with the printing process.

FIGS. 15 to 17 exemplify various operations which may accompany theimplementation of the circuit network 30 exemplified as twoelectrically-conductive lines 301, 302.

Specifically, FIGS. 15 and 16 exemplify that protective layer 14 aprotecting tracks 141, 142 has been removed, while the top face of base10 has been subjected to a surface treatment 30 a (e.g. a corona orplasma treatment) adapted to simplify the formation of circuit 30 via aprinting process.

The deposition of such an ink onto the (generally planar) surface ofsubstrate 10 may take place e.g. by means of a stencil technique.

In one or more embodiments, the dry thickness of the ink of circuit 30may be chosen so as to correspond to the thickness of a conductive layerwhich has been chemically etched. This is exemplified in FIG. 17,wherein the printed lines 301, 302 are shown as having the samethickness as lines or traces 141, 142 obtained by means of chemicaletching.

Ink printing may be a more rapid process than chemical etching, and maylead to an easy management, also as regards customization, of thefeatures of circuit 30, e.g. by means of simply substituting masks orprint templates (or optionally by modifying a software controlling theprinting operation, e.g. in the case wherein the printing operation ofcircuit 30 is performed as 3D printing).

After the optional possible application of a further mask or cover onthe upper face of the electrically-conductive layer (which may becarried out by means of screen-printing or with a protective materialsuch as Liquid Photo Imageable (LPI), which is not explicitly shown inthe Figures), on lines 301, 302 it is possible to apply a solder pasteor an electrically-conductive adhesive material adapted to enablemounting components L.

This may be carried out according to implementation criteria similar towhat shown with reference to FIGS. 9 and 10.

As previously stated, in one or more embodiments tracks 141, 142(obtained via chemical etching) and lines 301, 302 (obtained byprinting) may be connected with (e.g. SMD) components having an ohmicvalue virtually amounting to zero.

FIGS. 20 to 29 exemplify (without intending to limit all the possiblecombinations) the possibility of using one or more features or operationsteps previously described with reference to FIGS. 1 to 19 in differentcombinations from what has been exemplified in the foregoing.

For this reason, in FIGS. 20 to 29 parts or elements corresponding toparts or elements already described with reference to FIGS. 1 to 19 aredenoted with the same references, without repeating the descriptionthereof.

For example, FIGS. 20 to 29 show embodiments wherein the starting pointis a base layer 10 coupled (e.g. via an adhesive layer 140) to anelectrically-conductive (e.g. aluminium or copper) layer 14.

In one or more embodiments as exemplified in FIGS. 20 to 29, forming theset of tracks 141, 142 (once again, the number of said tracks may bechosen at will) may take place according to a procedure substantiallycorresponding to what has been exemplified with reference to FIGS. 1 to10.

This also applies to the possibility of implementingelectrically-conductive vias 16 through the structure, in such a way asto achieve an electrical interconnection of electrically-conductivelayer 14 with the opposite side of base film 10.

In this case, according to criteria substantially similar to what hasbeen exemplified with reference to FIGS. 11 to 19, a circuit network 30may be implemented by printing with electrically-conductive inks.

In this respect, FIG. 21 exemplifies the possibility of drilling,through base structure 10, 14, 140 (it must be remembered that thepresence of intermediate layer 140 is optional) through holes 140, whichmay then be capped e.g. by means of an electrodeposition process, so asto form electrically-conductive vias 16 (with an optional layer ofsurface plating 160 a on the outer surface of layer 14).

As exemplified in FIG. 23, layer 14 may be subjected to chemical etchingor engraving, so as to form the set of (two or more)electrically-conductive tracks 141, 142.

FIG. 24 exemplifies the possibility of forming, in order to cover tracks141, 142, a bottom layer 18 which may be adhesively connected to thestructure, as shown at 180.

FIG. 25 exemplifies the possibility of subjecting front (or top) surfaceof layer 10 to a surface treatment (e.g. a corona or plasma treatment),denoted as 30 a, so as to make the material of base layer 10 printable(e.g. with ink printing techniques), the possibility being given againto remove oxidation at the upper end of the electrically-conductive vias16 (which may be made e.g. of copper).

In one or more embodiments, by acting according to a procedure whichsubstantially resembles to what previously described for the embodimentsexemplified in FIGS. 11 to 19, circuit 30, again exemplified as twolines 301 and 302, may be formed by printing.

In this case, too, such a process may be more rapid than a chemicalprocess, while enabling a high degree of possible customization of thecircuit by replacing masks, tools (or by modifying software in the caseof 3D printing).

FIG. 27 exemplifies the possibility of applying onto circuit 30, byacting substantially according to the procedures exemplified in FIG. 8and following, the masking or protective layer 20 (solder mask or coverlay), which may be applied e.g. via screen-printing or via a techniqueknown as Liquid Photo Imageable, LPI, so as to leave certain chosenportions of circuit 30 free.

Such portions of circuit 30 which are left free by protective material20 may then be provided with soldering masses or with anelectrically-conductive adhesive 24, which enable mounting components L(LEDs and/or others) to complete a lighting device structure.

One or more embodiments may therefore concern a method of manufacturingsupport elements for lighting devices, the method including:

-   -   providing an elongated, electrically non-conductive substrate        (e.g. 10) with opposed surfaces, said substrate having an        electrically-conductive layer (e.g. 14) extending along one of        said opposed surfaces,    -   subjecting to (e.g. chemical) etching said        electrically-conductive layer, to provide a set of        electrically-conductive tracks (e.g. 141, 142) extending along        said non-conductive substrate (10) with at least one portion of        said non-conductive substrate (i.e. the opposed surface, in the        embodiments exemplified in FIGS. 1 to 10 or in the embodiments        exemplified in FIGS. 20 to 29; the area of the same surface        lying between the lines 141, 142 in the embodiments exemplified        in FIGS. 11 to 19) left free by said set of        electrically-conductive tracks,    -   forming a network of electrically-conductive lines (e.g. 121,        122 or 301, 302) coupleable with at least one        electrically-powered light radiation source (e.g. L) at said        portion of said electrically non-conductive substrate left free        by said electrically-conductive tracks, wherein said forming        includes:    -   i) selectively removing, e.g. via laser etching (LE), a further        electrically-conductive layer (layer 12, so as to form lines        121, 122, in the embodiments exemplified in FIGS. 1 to 10)        provided on said non-conductive substrate, or    -   ii) printing electrically-conductive material (e.g. 30, so as to        form lines 301, 302 in the embodiments exemplified in FIGS. 10        to 19 or in the embodiments exemplified in FIGS. 20 to 29) onto        said non-conductive substrate, and    -   electrically coupling (e.g. 16 or 32) said set of        electrically-conductive tracks and said network of        electrically-conductive lines.

One or more embodiments may include:

-   -   forming said network of electrically-conductive lines on the        other of said opposed surfaces of said non-conductive substrate,        and    -   coupling said electrically-conductive tracks and said network of        electrically-conductive lines by means of        electrically-conductive vias (e.g. 16) extending through said        non-conductive substrate.

One or more embodiments may include:

-   -   providing said at least one portion of said non-conductive        substrate left free by said electrically-conductive tracks at        said one of said opposed surfaces along which said etched,        electrically-conductive layer extends (e.g. between tracks 141        and 142 in the embodiments exemplified in FIGS. 1 to 10),    -   electrically coupling said electrically-conductive tracks and        said network of electrically-conductive lines by means of        electrically-conductive elements (e.g. 32) mounted at said one        of said opposed surfaces of the non-conductive substrate.

In one or more embodiments, said electrically-conductive elements mayinclude components, optionally SMD components, with zero ohmic value.

One or more embodiments may include providing a base layer (e.g. 18)covering said set of electrically-conductive tracks at said one of saidopposed surfaces of non-conductive substrate (10).

In one or more embodiments, said electrically non-conductive substratemay include a ribbon-like flexible member.

In one or more embodiments, said at least one portion of saidnon-conductive substrate left free by said set ofelectrically-conductive tracks (namely the portion onto whichelectrically-conductive material e.g. 30 can be printed so as to formlines 301, 302 in the embodiments exemplified in FIGS. 10 to 19 or inthe embodiments exemplified in FIGS. 20 to 29) may include a flatportion.

One or more embodiments may include electrically coupling at least oneelectrically-powered light radiation source, optionally of the LED type,to said one network of electrically-conductive lines.

One or more embodiments may include mounting said at least oneelectrically-powered light radiation source onto said network ofelectrically-conductive lines with SMD technology.

One or more embodiments may concern a lighting device including:

-   -   a support element produced with the method according to one or        more embodiments, and    -   at least one electrically-powered light radiation source,        electrically coupled with said network of        electrically-conductive lines.

In one or more embodiments, said at least one electrically-powered lightradiation source may include a LED source (L).

Without prejudice to the basic principles, the implementation detailsand the embodiments may vary, even appreciably, with respect to what hasbeen described herein by way of non-limiting example only, withoutdeparting from the extent of protection.

The extent of protection is defined by the annexed claims.

While the disclosed embodiments have been particularly shown anddescribed with reference to specific embodiments, it should beunderstood by those skilled in the art that various changes in form anddetail may be made therein without departing from the spirit and scopeof the disclosed embodiments as defined by the appended claims. Thescope of the disclosed embodiments is thus indicated by the appendedclaims and all changes which come within the meaning and range ofequivalency of the claims are therefore intended to be embraced.

1. A method of manufacturing support elements for lighting devices, the method comprising: providing an elongated, electrically non-conductive substrate with opposed surfaces, said substrate having an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along said non-conductive substrate with at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks, forming at said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks a network of electrically-conductive lines coupleable with at least one electrically-powered light radiation source, wherein said forming includes: i) selectively removing a further electrically-conductive layer provided on said non-conductive substrate, or ii) printing electrically-conductive material onto said non-conductive substrate, and electrically coupling said set of electrically-conductive tracks and said network of electrically-conductive lines.
 2. The method of claim 1, further comprising: forming said network of electrically-conductive lines on the other of said opposed surfaces of said non-conductive substrate, and electrically coupling said set of electrically-conductive tracks and said network of electrically-conductive lines by means of electrically conductive vias extending through said non-conductive substrate.
 3. The method of claim 1, further comprising: providing said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks at said one of said opposed surfaces along which said etched, electrically-conductive layer extends, electrically coupling said set of electrically-conductive tracks and said network of electrically-conductive lines by means of electrically-conductive elements mounted at said one of said opposed surfaces of the non-conductive substrate.
 4. The method of claim 3, wherein said electrically-conductive elements include components with zero ohmic value.
 5. The method of claim 1, further comprising providing a base layer covering said set of electrically conductive tracks at said one of said opposed surfaces of the non-conductive substrate.
 6. The method of claim 1, wherein said electrically non-conductive substrate includes a ribbon-like flexible member.
 7. The method of claim 1, wherein said at least one portion of said non-conductive substrate left free by said set of electrically-conductive tracks includes a flat portion.
 8. The method of claim 1, further comprising electrically coupling to said network of electrically-conductive lines at least one electrically-powered light radiation source.
 9. The method of claim 8, wherein said electrically coupling includes mounting said at least one electrically-powered light radiation source onto said network of electrically-conductive lines with SMD technology.
 10. A lighting device, comprising: a support element produced with a method of manufacturing support elements for lighting devices, the method comprising: providing an elongated, electrically non-conductive substrate with opposed surfaces, said substrate having an electrically-conductive layer extending along one of said opposed surfaces, etching said electrically-conductive layer to provide a set of electrically-conductive tracks extending along said non-conductive substrate with at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks, forming at said at least one portion of said electrically non-conductive substrate left free by said set of electrically-conductive tracks a network of electrically-conductive lines coupleable with at least one electrically-powered light radiation source, wherein said forming includes: i) selectively removing a further electrically-conductive layer provided on said non-conductive substrate, or ii) printing electrically-conductive material (30) onto said non-conductive substrate, and electrically coupling said set of electrically-conductive tracks and said network of electrically-conductive lines, and at least one electrically-powered light radiation source electrically coupled with said network of electrically-conductive lines.
 11. The lighting device of claim 10, wherein said at least one electrically-powered light radiation source includes a LED source.
 12. The method of claim 4, wherein said components are SMD components.
 13. The method of claim 1, further comprising electrically coupling to said network of electrically-conductive lines at least one electrically-powered light radiation source of the LED type. 